Historical Context and Growth

The concept of flexible circuits dates back to the early 20th century. In 1903, German inventor Albert Hanson filed a patent for a “printed wire,” describing a method of using conductive ink to print circuits on an insulating substrate. However, this idea remained largely theoretical until the 1920s.  Between 1997 and 2017, patent filings for flexible electronic devices, including flexible PCBs, increased by 15.7%. Notably, over half of these filings occurred between 2013 and 2017, indicating a surge in research and development.

Recent Patent Trends

Recent patents in the flexible PCB domain have highlighted significant advancements across multiple key areas, driving innovation in the industry. One of the primary focuses has been on the materials and composition used in flexible PCBs. Researchers are exploring novel conductive and insulating materials that enhance these circuits’ flexibility, durability, and performance. These innovations are crucial for flexible PCBs, as they need to maintain high electrical performance while withstanding bending and stretching, making them suitable for applications in wearable devices, flexible electronics, and automotive systems.

Another area of innovation lies in manufacturing processes. Traditional methods of producing flexible PCBs can be costly and time-consuming, especially when creating complex structures. New inkjet printing techniques offer a more efficient and cost-effective solution for fabricating rigid-flexible PCBs. These processes simplify production and allow for more precise material deposition, lowering production costs and reducing material waste. The ability to print flexible PCBs directly could also pave the way for on-demand, low-volume manufacturing, making it more accessible for smaller enterprises and startups in the electronics space.

In terms of design and structure, recent patents reveal innovations such as double-sided flexible PCBs are a breakthrough in improving the functionality of compact devices. By utilizing both sides of the board for component placement, these designs significantly increase the circuit’s capacity without expanding the device’s footprint. This is especially valuable in devices like smartphones, medical wearables, and other portable electronics, where space is restricted and efficiency is key. Moreover, these design advancements boost integration, enhancing the overall performance and reliability of flexible PCBs in demanding environments.

Market Dynamics

The global flexible PCBs market is valued at approximately $22.4 billion in 2024 and is projected to grow at a CAGR of ~13% from 2025 to 2030. The double-sided flexible PCB segment holds the highest position in the flexible PCB industry, with a 46.1% revenue share. North America is expected to hold a significant market share, followed by Europe and the Asia-Pacific region.

Future Outlook

The future of flexible PCBs is poised for significant advancements across the electronics, automotive, and medical sectors. In electronics, flexible PCBs will be pivotal in developing next-gen form factors such as foldable, rollable, and stretchable devices, including tablets, laptops, and smartwatches, all requiring flexible circuitry. As AI and edge computing continue to expand, ultra-compact edge devices will rely on lightweight, flexible PCBs for enhanced performance. The growth of electric vehicles (EVs) and autonomous driving technologies in the automotive industry will drive demand for flexible PCBs in applications like battery management systems, LiDAR/radar modules, and in-cabin electronics such as infotainment and ambient lighting. Additionally, integrating flexible lighting and touch interfaces in curved surfaces and smart interior panels will further fuel adoption. In healthcare, flexible PCBs will support the next generation of body-conformal wearables, offering real-time diagnostics such as glucose monitoring, hydration sensors, and ECG patches. Miniaturized, biocompatible, flexible PCBs will also become crucial for implantable devices and neural interfaces. With the rise of AI and IoT, flexible PCBs will enable low-power, always-on sensors for smart home devices, industrial IoT, and environmental monitoring systems. Sustainability will drive the evolution of flexible PCBs, focusing on eco-friendly materials, energy-efficient manufacturing processes, and designs that promote disassembly and recycling.

IP Perspective

The flexible PCB industry is changing gears and shifting from structural designs to materials, manufacturing processes, and multifunctional integration advancements. Major players like Samsung, LG, and Fujikura are strategically building broad defensive portfolios while emerging opportunities lie in sustainable flexible PCBs, healthcare wearables, and 5G electronics. As collaborative R&D and cross-sector convergence accelerate, companies aligning their IP strategies with high-growth applications and ESG goals will gain a competitive edge.

Conclusion

The patent landscape for flexible printed circuit boards reflects a dynamic and rapidly evolving field, with continuous innovations in materials, manufacturing processes, and applications. As technology advances, flexible PCBs are considered one of the key parts in developing next-generation electronic devices.

Connect with our competent team of patent analysts & technology experts to discover how we can help you incorporate advanced features into your products, ensuring they stand out in the market and keep you ahead of the competition. Let us support you in elevating the innovation and appeal of your offerings.

Write us at contact@iebrain.com to get access to sample reports on flexible PCBs.